Given that the camera module component plays an increasingly crucial role in digital products, allow's learn more regarding it so that you can make the right choices worrying camera module of your products. We're mosting likely to give some pointers and also the manufacturing procedure of camera components in the following content.
Prior to we get down to the production procedure of a camera component, it is very important that we obtain just how the sensing unit is jam-packed clear. Because the way of product packaging affects the production procedure.
Sensor is a vital component in the video camera module. In the manufacturing procedure of a camera component, there are two methods to pack the sensor: chip scale package ( CSP) and chip on board ( COB).
CSP suggests the bundle of the sensor chip has an area no higher than 1.2 times that of the chip itself. It's done by the sensing unit maker, as well as typically there is a layer of glass covering the chip.
COB suggests the sensing unit chip will certainly be straight bonded to PCB (printed circuit card) or FPC (flexible printed circuit). COB process is part of the electronic camera module manufacturing process, therefore it's done by the cam component supplier.
Contrasting both product packaging choices, CSP process is much faster, more precise, much more costly, as well as might create poor light passage, while COB is much more space-saving, more affordable, however, the process is much longer, the return trouble is bigger, as well as can't be repaired.